Semiconductor Packaging Solutions (October
1998-Present)
Title: Owner and Founder This is a name change from
A&H Technology, and a return to full time operation of my engineering, consulting and
assembly business. The focus has shifted to higher power module and power IC package
designs, with expanded laboratory for characterization, life testing and failure analysis.
Thermal modeling and simulation are important additions. Significant effort has been
devoted to IMS substrate evaluation, improvement and application support through a
long-term contract with Thermagon, Inc.
International Rectifier Corp (December 1989-January 1999)
Title: Director of Engineering Responsible for
developing packages for a line of Motor Control Products(1-15HP), and for on-going product
engineering. Product function included inverters(IGBT), rectifier, protection and drivers.
This included significant customer and application interface, and patents.
Title: Director of Engineering, Advanced Products
Responsible for the design of High Power IGBT module packages and products(25-1000A),
including development of assembly processes and equipment, and transfer of manufacturing
to plants in Italy and Mexico. These products included the introduction of IMS and DBC
technology to IR, and patents.
Title: Director of Engineering, Microelectronics Relays
Responsible for engineering of this group, and for the development of many opto-isolated
relay packages and high voltage power IC packages.
A&H Technology (April 1985-September 1998)
Title: Owner and Founder Responsible for
establishing a semiconductor package engineering and consulting firm, providing new
package and process development to the semiconductor and hybrid module industries,
specializing in power IC products. Representation of Sub-contract assemblers in Southeast
Asia, to U.S. and Canadian companies, has been an integral part of this business, and the
facilities to develop and build new packages and products.(Limited activity since
September 1992)
Silicon General Semiconductors (November 1978-April 1985)
Title: World Wide Assembly Operation Manager
Responsible for assembly operations in Garden Grove(S-Level) and Puerto Rico(MIL-STD883),
and sub-contract assembly(Commercial) in the Philippines and Korea. Responsibilities
include P&L for all assembly, package/process engineering, and corporate purchasing.
Title: Hybrid Plant Manager Responsible for
establishing a Power Hybrid Group including facilities, equipment and products, and the
operation of this group with P&L responsibility at record profit margins.
RCA Government & Commercial Systems (August 1976-November 1978)
Title: Manufacturing Engineering Manager Responsible
for manufacturing engineering and support, and new product, package and process
development of the RCA Portable Radio Group with high density RF hybrids and PCB
technologies.
TRW Semiconductors (September 1973-August 1976)
Title: Thick-Film Hybrid Project Manager Responsible
for establishing and operating a thick-film hybrid group that supported the RF and Power
Product lines. Developed many new products, BeO metalization, copper TF ink, and die/wafer
solder contacts.
Composite Microcircuits (June 1971-July 1973)
Title: Chief Engineer Responsible for new product
development, manufacturing engineering and electrical design of this RF and Telecom hybrid
company. Converted Sylvania R&D technology into products.
Sylvania Microelectronics (April 1968-December 1971)
Title: R&D Engineer Responsible for the development
of thick-film materials and hybrid assembly processes, and for military TF multilayer
reliability evaluation. Also developed unique thick-film glass, conductor and capacitor
materials, and structures.
Education
Geneva College Beaver Falls, PA B.S. Degree, Major:
Physics, Minor: Chemistry & Mathematics
University of Wyoming Laramie, WY Graduate Studies in
Physics
Boston College Boston, MA Graduate Studies in
Physics(part-time)
California State University Long Beach, CA Graduate
Studies in Physics(part-time)
Awards
Physics Achievement Award, Geneva College, 1963-64
Departmental Ph.D. Traineeship, University of Wyoming, 1967
Patents
Numerous patents on power modules and semiconductor
packages, special processes and manufacturing techniques.
|
