| Semiconductor Packaging Solutions
can provide complete module designs, prototype samples and evaluation, or they can provide
consulting support to your in-house design and improvements. SPS experience includes Thick-Film, Direct-Bond Copper and Insulated Metal Substrate modules. The assembly technology has been primarily surface mount and Chip & Wire techniques, and the associated mechanical package and manufacturing techniques. In recent years, the SPS focus has been on power modules with mosfet and IGBT devices. These devices have used voltages as high as 1200V and currents as high as 1000A. Important considerations with power modules include low thermal resistance, low inductance, switching losses, ground currents, external interconnects and regulatory agency considerations. SPS can provide both the practical experience and the analytical tools required for power module design, assembly and evaluation. Power module design must integrate knowledge of special materials and processes to deal with the high voltages and high currents, and often high frequencies. These considerations are important for performance, reliability and manufacturability. Power module performance and reliability are often application specific. SPS can provide application specific solutions based on experience and analytical tools. Areas of concern may include environment, power cycling, temperature cycling, operating temperatures, and thermal-mechanical stresses. These considerations can influence the selection of materials, package construction, die and wire size, equipment, and assembly techniques. SPS expertise include special metals, plastics, solders, molding compounds and coatings, and the associated equipment and tooling. Support can include design, selection, procurement and evaluation with materials, equipment and tooling. The SPS experience and modeling can help select proven techniques when available, and provide direction for new package development where the available technology is not suitable. This approach allows short design cycles, minimum cost and minimum risk. SPS can often provide quick economical samples and evaluation internally, and they can recommend contract assembly and testing for final evaluation and qualification. We can also provide consulting support for your internal evaluation, qualification, failure analysis, reverse engineering, facilities and equipment procurement. Again, Power module design and assembly involves many areas of specialization, and experience and proven analytical techniques can often save significant time and money with low cycle time and first time success. |
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