Power discretes and power ICs have also used the standard packages when possible. Special power packages have been designed where absolutely necessary, but these options have been more expensive with high tooling costs and higher unit costs.

Integrated Circuit functions, power density, and frequency have been continuously increasing. SPS has many years experience in modifying standard packages to accommodate special functions by integrating the devices into standard IC package lines, equipment and processes at existing off-shore contract assemblers. This approach minimizes cost, cycle-time and risk. Some typical modifications include multi-chip, higher power, higher voltage, higher current, higher frequency and integrated optical products. Often the changes are limited to custom leadframes, special materials, special large wires, and special solders. Such changes have been used to modify standard P-DIP, SOIC, PLCC and other standard packages for special functions and performance. These changes can often be done with little or no change to the standard package outline.

SPS has also modified standard printed circuit boards and substrates to improve the thermal performance of the attached standard and power IC packages. These changes have been performed for SOIC, PLCC and BGA packages, and have included preliminary thermal modeling and post confirming thermal measurements.

SPS can provide custom power package designs, when standard packages cannot effectively be used or modified. Custom package design experience includes the design of leadframes, molds, substrates, trim & form tools, process development, material selection and performance/reliability evaluation.