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An integral part of the SPS power packaging expertise is thermal management. It
begins with thermal modeling and a broad database of Rjc and Rja for many standard and
custom packages. SPS has the capability for testing thermal resistance of packages,
substrates and special materials. Thermal management often is broader than temperature control. In many power products the higher temperatures create thermal expansion mismatches between components and materials. These mismatches should be modeled and managed in the initial design, and evaluated in operation and life testing of the finished products. In addition to thermal management of the power packages and modules, we can help with system thermal management. This can include heatsinks, heat spreading, cold plates, forced air and more. Thermal management of surface mount components on printed circuit boards can be enhanced with thermal dielectrics like the Thermagon T-preg, and with heavy copper foil, thermal vias and strategically located power & ground planes. In most systems, these thermal improvements can be modeled before defining and building the first engineering samples. |