The thermal substrates have been used for surface mount and chip & wire modules. The modules have been used for 115, 230 and 460 VAC line products in the U.S. and Europe, and have addressed the corresponding regulatory agency evaluation and approval.

SPS is currently under contract to Thermagon, Inc. to provide application support and new material evaluation for their premium thermal substrates and thermal multilayer boards. The Thermagon T-lam thermal substrates and boards are an insulated metal or metal core substrate. Courtney Furnival has written the design guidelines and application papers for the T-lam product. See the Thermagon "T-guide for Performance", "T-guide for Manufacturability" and "Thermal and High Current Multilayer PCB" on the Thermagon web site at www.Thermagon.com. The Thermagon T-lam products use a T-preg dielectric layer that is about 20 times more conductive than FR-4 materials. The T-lam can be thermally competitive with DBC, and much more economical. In addition to supporting T-lam applications, SPS works with board fabricators that have experience with T-lam materials, and with heavy copper foil boards and metal core substrates. These fabricators can implement the thermal dielectrics into higher power products that require superior thermal performance.  These techniques are often used for planar magnetics PCBs.